[sdiy] Making toast with chips

[Magnus Danielson]

From: Seb Francis <seb at is-uk.com>
Subject: Re: [sdiy] Making toast with chips
Date: Thu, 28 Nov 2002 13:53:57 +0000

> KA4HJH wrote:
> 
> > >> >I notice the hotter ones generally (though not exclusively) have a P
> > >> >suffix and are dual types while the cool ones are N suffix.
> > >>
> > >> <smartass mode>
> > >>
> > >> P = poor
> > >> N = nice
> > >>
> > >> </smartass mode>
> > >
> > >BTW, I think the P suffix ones are Texas Instruments and the N suffix ones
> > >are Phillips.  Could be other manufacturers using those letters too tho?
> >
> > P is ceramic, N is "plastic". This is *supposed* to be a standard.
> > --
> 
> Hmm, not so for the TI NE5532P - they are plastic.  Still I guess standards (like) rules are there to be broken!

No... they follow the manufactures own standard. You've got no alternative than
checking what the specific manufacture has to say about how they cook their
names for that product. I'd never trust a rule of thumb, since it never really
works, they are all more or less different.

There are standards for packages, but those names are very rarely actually
written on things like DIP8. I recommend you to get the JEDEC stuff.

Cheers,
Magnus