[sdiy] thermal coupling question
Tim Parkhurst
tparkhurst at siliconbandwidth.com
Tue Jan 21 21:52:58 CET 2003
> So my question is how to achieve the best thermal contact. Do the two
> components need to be physically touching or can they just be next to each
> other with a dollop of some magical heat conducting compound binding them
> (...in the darkness...). I'd hope to come up with something more elegant
> than heat sink grease...
Yes, you do want them physically touching. Like a first date; the more
contact, the better. A TEEEENY bit of heat sink compound might help too. It
helps bridge small gaps and increases heat transfer.
I would also think (although I have never tested this) that enclosing the
thermal components would also help eliminate drafts / currents /
condensation effects. Maybe cover them with heat shrink and/or pot them in
epoxy. I remember hearing how drafts and ambient temperature or humidity
changes would drive early Moog oscillators out of tune. Maybe this is
another reason for ARP to pot its early VCO and VCF modules (that, and
trying to avoid lawsuits...)
Tim Servo
"Imagination is more important than knowledge." - Albert Einstein
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