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Message

RE: [AVR-Chat] d2pak heat sink

2011-02-02 by Steve Hodge

Tim, I can't find the attachment.

 

From: AVR-Chat@yahoogroups.com [mailto:AVR-Chat@yahoogroups.com] On Behalf
Of tim gilbert
Sent: Tuesday, February 01, 2011 7:21 PM
To: AVR-Chat@yahoogroups.com
Subject: Re: [AVR-Chat] d2pak heat sink

 

  

Steve,
I've attached a print of the corner of a board we did this way. Note that
the holes are really big, 0.062". I did this to allow for air flow but have
no idea what difference it makes. Maybe smaller holes are better? Someday I
should try and model this in our 3D CAD.

Tim Gilbert
JEM Innovation Inc.
www.jeminnovation.com
www.pdksolutions.com

----- Original Message ----- 
From: Steve Hodge 
To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com>  
Sent: Tuesday, February 01, 2011 7:27 PM
Subject: RE: [AVR-Chat] d2pak heat sink

Thanks, Tim. Since the tab is ground, I assume you just connect the upper
one to a regular ground plane on the bottom?

I came across an App Note (#994) on the International Rectifier website that
made measurements of the thermal resistance of various SMD packages, using 3
different "pcb heat sink" techniques. Although the bottom of their test
board was "fully metalized" there is no mention of explicitly connecting it
to the test patterns on the top with vias. I suppose some heat conducts
through the fiberglass but your technique should give significantly lower
thermal resistances than they measured because the thermal conductivity of
copper is 10000 times that of fiberglass.

Steve

From: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com>
[mailto:AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> ] On
Behalf
Of tim gilbert
Sent: Tuesday, February 01, 2011 4:33 PM
To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> 
Subject: Re: [AVR-Chat] d2pak heat sink

Steve,
For such packages, I usually just expand the copper area around the device
on both the top and bottom layers. I then interconnect them with lots of
large vias. Effectively building a heat sink into the board.

Tim Gilbert
JEM Innovation Inc.
www.jeminnovation.com
www.pdksolutions.com

----- Original Message ----- 
From: Steve Hodge 
To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com>
<mailto:AVR-Chat%40yahoogroups.com> 
Sent: Tuesday, February 01, 2011 2:45 PM
Subject: [AVR-Chat] d2pak heat sink

I've been checking out the various heat sinks for D2PAK devices and confess
to being confused as to how they are mounted. I'd also like some
recommendations, if anybody has any, for ones that are the easiest to use.
I need to be able to hand solder things.

Thanks, Steve

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