Tim, I can't find the attachment. From: AVR-Chat@yahoogroups.com [mailto:AVR-Chat@yahoogroups.com] On Behalf Of tim gilbert Sent: Tuesday, February 01, 2011 7:21 PM To: AVR-Chat@yahoogroups.com Subject: Re: [AVR-Chat] d2pak heat sink Steve, I've attached a print of the corner of a board we did this way. Note that the holes are really big, 0.062". I did this to allow for air flow but have no idea what difference it makes. Maybe smaller holes are better? Someday I should try and model this in our 3D CAD. Tim Gilbert JEM Innovation Inc. www.jeminnovation.com www.pdksolutions.com ----- Original Message ----- From: Steve Hodge To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> Sent: Tuesday, February 01, 2011 7:27 PM Subject: RE: [AVR-Chat] d2pak heat sink Thanks, Tim. Since the tab is ground, I assume you just connect the upper one to a regular ground plane on the bottom? I came across an App Note (#994) on the International Rectifier website that made measurements of the thermal resistance of various SMD packages, using 3 different "pcb heat sink" techniques. Although the bottom of their test board was "fully metalized" there is no mention of explicitly connecting it to the test patterns on the top with vias. I suppose some heat conducts through the fiberglass but your technique should give significantly lower thermal resistances than they measured because the thermal conductivity of copper is 10000 times that of fiberglass. Steve From: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> [mailto:AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> ] On Behalf Of tim gilbert Sent: Tuesday, February 01, 2011 4:33 PM To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> Subject: Re: [AVR-Chat] d2pak heat sink Steve, For such packages, I usually just expand the copper area around the device on both the top and bottom layers. I then interconnect them with lots of large vias. Effectively building a heat sink into the board. Tim Gilbert JEM Innovation Inc. www.jeminnovation.com www.pdksolutions.com ----- Original Message ----- From: Steve Hodge To: AVR-Chat@yahoogroups.com <mailto:AVR-Chat%40yahoogroups.com> <mailto:AVR-Chat%40yahoogroups.com> Sent: Tuesday, February 01, 2011 2:45 PM Subject: [AVR-Chat] d2pak heat sink I've been checking out the various heat sinks for D2PAK devices and confess to being confused as to how they are mounted. I'd also like some recommendations, if anybody has any, for ones that are the easiest to use. I need to be able to hand solder things. Thanks, Steve __________ Information from ESET Smart Security, version of virus signature database 5838 (20110201) __________ The message was checked by ESET Smart Security. http://www.eset.com [Non-text portions of this message have been removed] __________ Information from ESET Smart Security, version of virus signature database 5838 (20110201) __________ The message was checked by ESET Smart Security. http://www.eset.com __________ Information from ESET Smart Security, version of virus signature database 5838 (20110201) __________ The message was checked by ESET Smart Security. http://www.eset.com [Non-text portions of this message have been removed] [Non-text portions of this message have been removed] __________ Information from ESET Smart Security, version of virus signature database 5838 (20110201) __________ The message was checked by ESET Smart Security. http://www.eset.com __________ Information from ESET Smart Security, version of virus signature database 5838 (20110201) __________ The message was checked by ESET Smart Security. http://www.eset.com [Non-text portions of this message have been removed]
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RE: [AVR-Chat] d2pak heat sink
2011-02-02 by Steve Hodge
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