Hi, tried it today, with mixed results (but definitely worthwhile). A few things i noticed: There seem to be two "stages" of tinning. Where the heat of the heatgun was greatest, just below the center of the nozzle, the reflow was more complete. What i see there is s rough surface. Like the paste was much coarser as it actually is. On the other hand in areas with less heat it appears that the board is still tinned nicely, but with a shiny, uniform, and thinner. I wonder how the paste can tin the board without actually reflowing... Also, i could not get the paste to reflow to a silver appearance before burning the board. I had expected it to go shiny silver at some stage, like SMD paste, but it didn't. It just stays the same dull grey, but after wiping the board off underneath is a shiny silver tinning? The packaging says one should see when it reflows. What about silkscreen? will it work over a board tinned that way? Do you drill before or after tinning? Note that i used a old solder paste with lead content, which gives a less silvery appearance anyway. I am planning to get tin only paste, also because it is a slightly messy procedure and i am not fond of "loose" lead particles around and in the water. I will make several sample pieces and heat them with different temperature settings, to find out about the strange reflow... ST
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[Homebrew_PCBs] solderpaste tinning
2005-09-11 by Stefan Trethan
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