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Re: [Homebrew_PCBs] Re: solderpaste tinning

2005-09-12 by Stefan Trethan

On Mon, 12 Sep 2005 12:10:00 +0200, Kevin Morgan <prizes@...> wrote:

>
> Possibly this might actually be a better way to process circuit
> boards than the higher temp reflow. My only complaint was that the
> plating was extremely thin. Also, I'm a little concerned about the
> environmental effects of washing off what must be the bulk of the
> solder.
> Kevin


It might be better, i noticed the same thinness but if it protects the  
copper from corrosion that would be enough for me.
I had the same thoughts about the chemical-like plating without actually  
reflowing.


With leadfree paste i'm not worried about the environmental effects as  
much, tin is not really a problem i think.
Maybe try applying it thinner in the first place.
I also wondered if a "hot sponge" method would work (maybe a steel wool  
sponge...).
Actually i was considering that before the whole solderpaste thing, a  
sponge holding a solder (not too much), and a fluxed board on a hotplate  
or freshly heated......


I will try that series of samples and see what happens at different  
temperatures, but i would like to use leadfree paste already.

ST

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