On Mon, 12 Sep 2005 12:10:00 +0200, Kevin Morgan <prizes@...> wrote: > > Possibly this might actually be a better way to process circuit > boards than the higher temp reflow. My only complaint was that the > plating was extremely thin. Also, I'm a little concerned about the > environmental effects of washing off what must be the bulk of the > solder. > Kevin It might be better, i noticed the same thinness but if it protects the copper from corrosion that would be enough for me. I had the same thoughts about the chemical-like plating without actually reflowing. With leadfree paste i'm not worried about the environmental effects as much, tin is not really a problem i think. Maybe try applying it thinner in the first place. I also wondered if a "hot sponge" method would work (maybe a steel wool sponge...). Actually i was considering that before the whole solderpaste thing, a sponge holding a solder (not too much), and a fluxed board on a hotplate or freshly heated...... I will try that series of samples and see what happens at different temperatures, but i would like to use leadfree paste already. ST
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Re: [Homebrew_PCBs] Re: solderpaste tinning
2005-09-12 by Stefan Trethan
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