Nah, doesn't fit. If i heat with hot air from above the powdery stuff must be hotter than the board. ST On Mon, 21 Nov 2005 21:46:59 +0100, Alan King <alan@...> wrote: > > > Think of having your board right at the melt point, and taking a solid > > lead pencil and writing on the traces. Pencil stays solid, but where > > you're touching the traces is melting. Traces are above the melt temp, > > but you're only getting melt when you make it touch. For sure it is > > melting some, just not a lot. Remember it takes a lot more energy for > > the phase change, so right near the melt temp you'll melt the surface > > but not have near enough extra heat to melt the rest of the solder > > balls. Might also be doing something with the flux at a higher temp, as > > someone else noted recently it stays on much longer just at the melt > temp.. > > > Think of how you draw on your iron tip with solder, as the iron is > > just heating up, leaves a nice shiny path. And won't melt the rest of > > the solder very fast yet, because it doesn't have enough extra heat. > > > Things well above the melt temp uaually oxidize much faster than > > things right at it, part of the reason a temp controlled soldering iron > > is a good thing too.. > > > Alan >
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Re: [Homebrew_PCBs] Re: Tinning the board? - reflow
2005-11-21 by Stefan Trethan
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