http://www.stencilsunlimited.com/TDS%20SynTECH.pdf http://www.stencilsunlimited.com/TDS%20NWS-4200-LF.pdf The first is a datasheet for tin/lead paste; the second for tin/silver/cu. The reflow profile is on page two of each. Flux activation happens around 140^C. Reflow doesn't begin until much higher, at 219^C for Sn/Ag/Cu. The spec'ed peak profile temperature is higher still, *minimum* 235^C. Full reflow will not be complete until 60 seconds after reaching 219^C. I suspect the residue is spent flux (?) and the shiny material might be unalloyed Sn in the paste reflowing at a lower temp. Just guessing. My paste is in the mail; I have nothing to do the next few days but kibitz your thinking. ----- Original Message ----- From: "Stefan Trethan" <stefan_trethan@...> To: <Homebrew_PCBs@yahoogroups.com> Sent: Monday, November 21, 2005 2:59 PM Subject: Re: [Homebrew_PCBs] Re: Tinning the board? - reflow > Nah, doesn't fit. > > If i heat with hot air from above the powdery stuff must be hotter than > the board. > > ST > > > On Mon, 21 Nov 2005 21:46:59 +0100, Alan King <alan@...> wrote: > >> >> >> Think of having your board right at the melt point, and taking a solid >> >> lead pencil and writing on the traces. Pencil stays solid, but where >> >> you're touching the traces is melting. Traces are above the melt temp, >> >> but you're only getting melt when you make it touch. For sure it is >> >> melting some, just not a lot. Remember it takes a lot more energy for >> >> the phase change, so right near the melt temp you'll melt the surface >> >> but not have near enough extra heat to melt the rest of the solder >> >> balls. Might also be doing something with the flux at a higher temp, as >> >> someone else noted recently it stays on much longer just at the melt >> temp.. >> >> >> Think of how you draw on your iron tip with solder, as the iron is >> >> just heating up, leaves a nice shiny path. And won't melt the rest of >> >> the solder very fast yet, because it doesn't have enough extra heat. >> >> >> Things well above the melt temp uaually oxidize much faster than >> >> things right at it, part of the reason a temp controlled soldering iron >> >> is a good thing too.. >> >> >> Alan >> > > > > > > Be sure to visit the group home and check for new Links, Files, and > Photos: > http://groups.yahoo.com/group/Homebrew_PCBs > > If Files or Photos are running short of space, post them here: > http://groups.yahoo.com/group/Homebrew_PCBs_Archives/ > Yahoo! Groups Links > > > > > > >
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Re: [Homebrew_PCBs] Re: Tinning the board? - reflow
2005-11-22 by Mike Young
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