I just now made up a simple single-sided circuit board with 12 mil tracks and 14mil spacing. Its all SMD. (Except for the DB-9 and 10- pin header.) I used the Dyna-Art paper. (They are called Pulsar, now.) Needless to say, this stuff has been sitting around on my shelf un-noticed for too long. But, I figured I should give TT a try for this small board (since I don't have any of the other method like EDM or CNC milling working - yet.) Anyway, the short of it is - the TT process went well. I used an ancient HP-5L with a real HP C3906A toner cartridge. I cleaned the board rather thoroughly with Comet and steel wool. I used moderate pressure on an iron for 5 minutes. (The Pulsar instructions say 3 minutes - but that didn't work.) All the toner ended up on the copper. I etched with Sodium Persulfate (it goes from clear to light blue, letting you easily monitor the process.) I used an aquarium bubbler in a shallow tank made from a small tupperware dish. I had the board horizontal the whole time. Not a good idea. The etching process took over 1.5 hours. Instead of the 0.5 indicated on the Sodium Persulfate. A couple of things might have worked against me. I had started with a rather hot etchant bath (kitchen tap water warm) but with the large flat surface, it quickly cooled. I was being stingy with the etchant...but it would be more effective I think to etch with the board held vertically in a thin tank, rather than horizontally in a shallow tank. Even with the bubbler, it was clear that the agitation was incomplete. Since the copper nearest the bubbler etched much* faster that the copper elsewhere. I ended up having to change the orientation of the board several times during the etching process. Disposable chopsticks made a good tool for doing this. :-) All-in-all, though, I was quite happy with the result. But, I wouldn't leave well enough alone. I decided I really wanted a tinned board. So, I picked up some plumber solder paste at the local hardware store. Except they didn't have the lead-based "Solder-It" brand. Instead, they had some Silver-based stuff. It is called "Flo-Temp" Lead-free instant Plumbing solder***. By Alpha Metals. Anyway, I spread on a thin layer using a chopstick. Well, not thin enough I think. I then hit it with the hot air gun (part of my SMD soldering station.) I watched it go through all the transitions that Stefan recounted. It seemed to be doing pretty much what I wanted. (It was fun watching the image of the board re-emerge as the stuff heated, melted, and grabbed onto the copper leaving the etched areas free.) But I wasn't pleased with how it looked. There was too much solder blobbed up on most of the board (some parts were OK...just at the edges...where I had probably accidently laid down less.) So I tried Stefan's suggested method for removing the excess. With a paper towel. Except, it didn't really want to come off. I used a slightly damp paper towel, btw. I shot the board again with the hot air gun - just before applying the towel. I suspect the wet towel might have cooled the board, I mean the solder, off too quickly, so it froze in place, instead of wiping aside. Any hints as to what to do next? On certain parts of the board, it looks tantilizingly like a professional job, with just the thinnest coating of silver barely hiding the copper. But most of the board looks like hell. At least there aren't any (or many) shorts. So, although its ugly, it should work. Should I try throwing it in the over to get even heat, and then a swipe with a dry paper towel? It is a little hard getting the solder across the whole board to be shiny, at the same time, with the hot air gun. I have a little toaster oven which is destined someday to be a reflow oven...but right now it hasn't any temperature regulation other than what it came with. Should I just set the oven to 450, wait for it to reflow, and then wipe off the excess? Or should I quit while I'm ahead...before I screw it up further...and over heat it so I pull up a trace? Nah...full speed ahead. Tomorrow I'll fire up that toaster oven. Jim *well, actually just a bit faster. Obviously with a 1.5 hour etch time, this wasn't going anywhere fast. **Actually, I think there was one other thing working against me. I am not certain that I cleaned the Pulsar papers "glue" off of the board completely enough before etching. Their procedure is to wipe the board once with the "depleted" paper after making the transfer, and then rinse under running water. I am not sure, but I thought I saw some residue still on the board. But, I figured it would come off in the bath. Finally, perhaps the etchant is old? I cannot remember how many years ago I purchased it. I am not clear on its shelf life. ***It says it melts at 430F. Regular lead-tin solder melts at 370F.
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Successful TT with Pulsar paper. Tinning "mishap" with Plumbers paste.
2006-05-15 by jzmuda2000
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