To put the HCl fume problem in perspective - I had been bubbling the etchamt solution with an open tank for over a week without any HCL damage, even on steel a few feet away. It was only when I started aerating with a much higher volume pump that the problem appeared. The etchant surface was so agitated that it was spitting some etchant out of the tank - and into the air. And the bigger compressor got warm enough that the air was being warmed, and increasing the temperature of the etchant. I understand a higher temperature alone may cause fuming. I believe the CuCl approach can be used without any fume damage, even without a fume exhaust. As to the slow process, this is in part due to my air sparger making largish bubbles. If I got an aquarium air stone the process would probably be much faster. Grant --- In Homebrew_PCBs@yahoogroups.com, Stefan Trethan <stefan_trethan@g...> wrote: > i really believe with this cost / etch i won't start the bubbling campaign. > this seems much to high effort (concerning the corrosive fuem discussion also). > regards > st
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CuCL too much effort ?
2003-04-29 by grantfair2001
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