>I get a bunch of nice spherical silver solder balls sitting in a >field of dried out grey mud Copper mass is such that there is insufficient heat to raise copper/paste temperature to proper range in a reasonable timeframe. Instead, the flux dries out well ahead of solder melting and starts to do more harm than good. If this is a test using an unetched piece of board then it may never work in that oven. You could try bringing the oven to maximum temperature for a while before placing the pasted board inside but even that may not work if there is too much copper. I use a hot air gun most of the time and an oven when there isn't too much copper to tin. --- In Homebrew_PCBs@yahoogroups.com, "Mark Merclean" <mamhouse@...> wrote: >
Message
Re: Doing something wrong tinning PCB
2007-02-04 by derekhawkins
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