> First you should worry about how your going to etch. You read my mine this was my next question. > If you decide on > pattern plate then you have choice of tin or tin/lead metal resist. If you > choose tin then you must use alkaline ammonia etch. If you choose tin/lead > then can use sulfuric/peroxide, ammonium persulfate etch, or ammonia etch. Is this the same stuff called Liquid Tin by MG Chemicals and a similar prodouct by Datak? Or would these get disolved by the etching solution? > However, I would be wary on having toxic lead plating solutions laying > around. For the ammonia etch it can be chloride or sulfate based. If > chloride based then you have major waste problems because the copper cannot > be recovered easily (at least what I know) and you will need to treat then > dump your solution ($$$). This is like ferric chloride? If you use sulfate based alkaline ammonia then > the etchant can be electrolytically regenerated although the etching rate > is much slower than chloride. > > PCB fabrication may look simple on a flow chart but when it comes to > actually making it work its a whole different story. > Please excuse my ignorance. I have a lot zeal and a lot to learn.
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Re: Plated Thru Hole at Home
2002-03-07 by j_hallows
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