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Re: [Homebrew_PCBs] Tin plating...

2003-05-20 by JanRwl@AOL.COM

In a message dated 5/19/2003 3:29:52 PM Central Standard Time, nuno-t@netc.pt 
writes:

> I’m also interested in such a formula.   I’ve heard that silver nitrate is 
> used to this purpose. Is this truth?  Does anyone have more info?
> 

TIN is in a completely different apartment on the Periodic Table.  AgNO³ will 
"plate" copper with NO DC applied.  It does NOT improve solderability at all, 
and will COST you more than the PCB itself, PER SIDE!  I recall when I was in 
high school, in '61, one fluid ounce of concentrated AgNO³ solution cost 
about $6.00, so that may well be $30 today for ONE fluid ounce!  Dunno...

Tin (Sn) is fussy, but Kepro, if my feeble old mind serves me, sells a 
yellow/white crusty chemical which "electrolessly" plates tin onto copper, 
and the only "energy" required is a bit of heat.  This stuff can be used over 
and over until depleted, but it DOES "go bad" with time, as I recall.  It 
also leaves a relatively THIN tin-plating on copper, but it DOES improve 
solderability if done SKILLFULLY (i.e., "cleanly").  I no longer have Kepro's 
address, but I IMAGINE they can be found on the Internet with an everyday 
Google search.

Jan Rowland


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