In a message dated 5/19/2003 3:29:52 PM Central Standard Time, nuno-t@netc.pt writes: > I’m also interested in such a formula. I’ve heard that silver nitrate is > used to this purpose. Is this truth? Does anyone have more info? > TIN is in a completely different apartment on the Periodic Table. AgNO³ will "plate" copper with NO DC applied. It does NOT improve solderability at all, and will COST you more than the PCB itself, PER SIDE! I recall when I was in high school, in '61, one fluid ounce of concentrated AgNO³ solution cost about $6.00, so that may well be $30 today for ONE fluid ounce! Dunno... Tin (Sn) is fussy, but Kepro, if my feeble old mind serves me, sells a yellow/white crusty chemical which "electrolessly" plates tin onto copper, and the only "energy" required is a bit of heat. This stuff can be used over and over until depleted, but it DOES "go bad" with time, as I recall. It also leaves a relatively THIN tin-plating on copper, but it DOES improve solderability if done SKILLFULLY (i.e., "cleanly"). I no longer have Kepro's address, but I IMAGINE they can be found on the Internet with an everyday Google search. Jan Rowland [Non-text portions of this message have been removed]
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Re: [Homebrew_PCBs] Tin plating...
2003-05-20 by JanRwl@AOL.COM
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