Ive gotten a responce from Frank of Pulsar, He states that the 1/16 board may need a little persuasion, but will pass through. He suggests we switch to the 1/32 board. I did in fact use the laminator w/a 1/32 double sided board and it worked but it warped and is very flexible. I dont think this will fair well w/ smd or my pc mount xfer. I told Frank about this but he seems to think it should be fine and that the warped board can be manually straightened. I really want to get this sorted for the 1/16 because the results are much much better than the clothes iron tech. I still cant wrap my brain around the fact that the h210 passes the 1/16 easily when the heat is turned down. I found a link that mods the older h200 to pass the media slower, but Frank says that is is not needed for the new h210 and that the h210 is a much better machine. I havnt had time to fiddle w/this, but on the WE I plan on doing alot of testing. Ill post then. wayne
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Re: Help w/ HeatSeal 210
2007-06-04 by wayneosdias
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