Hi folks, I'm a hobbyist circuit designer, but have come up against a few boards lately that are requiring a significant number of vias to route properly while maintinging optimal component placement. Normally, I would have just used a mechanical pth, but it's getting to be an increasing pain to do so. I read Adam's paper on the blackhole method and it leaves me with a few questions that I was hoping someone here could answer. I'm assuming that the entire process that Adam has posted is an activation that would be followed by a galvanic copper plating process. Am I correct in this assumption? If so, what exactly is microetching? a quick etch to prep the copper surface for plating adhesion? I'm interested in setting up a plating station that would use this method, but want to make sure that I fully understand how it works before I start down that path. Thanks, Dave
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Through hole plating question - Blackhole system
2007-09-12 by dpersuhn
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