Hmmm, I intend to use dryfilm laminate on both sides. The idea is to etch from both sides which I think might help keeping the undercuts at about half your rate. Just guessing though, and again, I definately will try this soon. Markus DJ Delorie schrieb: > > > Markus Zingg <homebrew-pcb@... > <mailto:homebrew-pcb%40shdesign.info>> writes: > > Were you using dryfilm resist laminate? > > No, toner transfer. Packing tape on the back side. > > > What's the thickness of the brass sheet? > > It varied from 2 to 5 mil. I've been favoring the thinner stuff. > > > Does this not lead to too much solderpaste on the pads? > > Yes, thicker means too much paste. A 5 mil thick sheet vs a 8 mil > wide opening is a big chunk of paste. > > The other issue is thickness of the brass vs the space between pins. > The undercutting is significant in this case; the holes end up being > wider on one side than on the other; sometimes the undercutting can > connect between openings. In general, an N mil thick sheet will be N > mils wider on the "near" (toner, photomask) side. > >
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Re: [Homebrew_PCBs] Homebrew stencils anyone?
2008-01-07 by Markus Zingg
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