Well, obviously experiences and opinions will vary as always. Your method involving the two irons seems awfully complicated compared to paste.... ST On Sun, Feb 22, 2009 at 11:39 PM, Adam Seychell <a_seychell@...> wrote: > > Do you apply a continuous trail of solder paste along each row of pads > of a quad plat pack IC ? If so you you use a syringe to apply the paste ?. > I found it easier to just use solder wire and dragging the iron across. > There are many videos on the net showing this method. > > For all small SMD parts (resistors, caps, transistors,...) I found > trying to apply paste to individual pads by syringe was waste of time. > It was much easier to: > > 1) tin all pads using a soldering iron and 0.5mm solder wire. > > 2) use tweezers to lay all components on the board in approximate location. > > 3) apply liquid rosin flux over the whole PCB. > > 4) use two soldering irons to simultaneously maneuver the component and > melt solder of each pad. > > > For desoldering large ICs I use a cheap electric hot plate from a > kitchen shop. I place layer of glass cloth followed by the PCB. I get > the PCB to 100 ~ 150C and then hot air gun on top to desolder the IC in > question. Lifts off in a breeze, without any collateral damage. > Double sided heating like this is much less heat stress. >
Message
Re: [Homebrew_PCBs] Surface Mount
2009-02-23 by Stefan Trethan
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