I would check the data sheets for your paste and your parts and see what kind of heating curve they use for re-flow soldering. Also, make sure you don't bake your parts to the point of no return. There should be a pre-heat ramp up in temperature and it usually plateaus for pre heating then rises up to reflow temp and then tapers back off. On Sat, Apr 4, 2009 at 5:04 AM, Jim Lewis <jim.lewis@...> wrote: > Thanks for all the tips. I pretty sure it's moisture in the paste. And it was much worse on a high-humidity day but not sure if that was a coincidence. Has anyone else noticed a connection to humidity? Does anyone know the ideal pre-heat temp and duration per the mfg? > > -- Erik L. Knise Pacific Shipping Company Seattle, WA
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Re: [Homebrew_PCBs] Re: Jumping chips
2009-04-06 by Erik Knise
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