I don't think mine is so conductive - I hope not. I can't imagine how anything can get the crud out from under a QFN package. Even a BGA seems relatively easy by comparision. Basically any component that sits flush against the board would seem pretty much impossible to me.... (Obviously there ought to be ways that I can't think of). ST On Sat, May 2, 2009 at 5:40 PM, DJ Delorie <dj@...> wrote: > > You folks aren't making this easy for me... ;-) > > One thing I noticed about my current no-clean is that the residue has > (relatively) low resistance. If I have a 25 mil gap between power and > ground, an inch of that results in 330k between them. I end up > scraping between traces to get the hardened residue off. > > I wonder if a waterpik would be enough to get those hard-to-reach > places that make people avoid water soluble flux? I do have some QFNs > in my current project... >
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Re: [Homebrew_PCBs] Re: solder paste choice
2009-05-02 by Stefan Trethan
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