I am using HCl (31%) + H2O2 (30%) + water in the ratio of 3:1:3 at room temperature with manual agitation (rocking) to etch some boards, but I'm having some problems. The boards seem to take a long time to etch (>15 minutes), and rather than etching evenly, the edges of the board etch first, then the perimeter of the non-etched area gradually decreases. I'm concerned that the etching from the edge will undercut the traces. What am I doing wrong? Other people report even etching in 1-5 minutes with this mixture, so I must be doing something wrong! Thanks for any help. Mark
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[Homebrew_PCBs] Etching Problem
2010-03-18 by Mark Lerman