Homebrew PCBs

NOTE:

I have the special metal CD insert for making 2.5" by 3.5" conventional circuit boards made by Full Spectrum Engineering.

You can read about it here:
http://www.fullspectrumengineering.com/pcbinkjet.html

Its yours for the asking (FREE) ....just drop me an e-mail or Yahoo IM





--- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@...> wrote:
>
> 
> 
> 
> 
> ..... an example of the conductive traces "reduction" ratio:
> 
> 64 pin leadless QFN RFID GEN2 UHF Reader IC with all required SMDs connected (res,caps,inductors,x-tal,etc.)
> 
> Conventional multi-layer "PCB"  verses "Flip n' Print"
> 
> 16 traces reduced to  4
>  5 traces reduced to  2
>  5 traces reduced to  2
> 14 traces reduced to  3
>  5 traces reduced to  2
> 23 traces reduced to 10
>  7 traces reduced to  4
>  5 traces reduced to  2
>  6 traces reduced to  3
>  8 traces reduced to  3
>  5 traces reduced to  2
>  6 traces reduced to  3
>  5 traces reduced to  2
> 
> Totals:
> 110 traces reduced to 41
> 
> Instead of a 5 or 6 layer conventional "PCB" (1.5" by 3/4") only 2 or 3 "printed layers" are needed.
> 
> By placing the SMDs "end to end" and "side by side" in combinations, for these connections, you afford essentially a zero "resistive loss",zero "stray inductance and capacitance" and highly conductive soldered connections.
> 
> With the now greatly reduced physical length of the "inkjetted conductive traces"(most are only 1/8" to 1/16" long), the higher resistance of the conductive inks now becomes negligible.
> 
> In essence, this assembly method uses the SMDs themselves as the majorty of the "wire traces" required.
> 
> 
> 
> 
> --- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@> wrote:
> >
> > 
> > Hello Homebrew Printed Circuit Group!
> > 
> > I have successfully modded my Epson Artisan 50 printer  Epson Printer
> > Mod
> > <http://groups.yahoo.com/group/Inkjet_PCB_Construction/photos/album/1664\
> > 97487/pic/list>   to make PCB boards.  I did this, as I'm sure as all in
> > this forum, want to quickly build working devices from all the many
> > awesome microchips out there (ie: MCU, RFID,WIFI,GSP, etc.)
> > 
> > In my current project, I need to fabricate a "system-in-package" (SIP)
> > module  containing an RFID reader chip (QFN), MCU chip and  WIFI
> > chip(QFN) on two PCB's (1 1/4" x 3/4") including the required discrete
> > SMD's (resistors, capacitors, inductors, x-tal, etc).
> > 
> > This project requires very small SMD's and a very small and dense
> > multi-layer PCB  with micro vias for fabrication.
> > 
> > This project well exceeds my existing "Homebrew" equipment capability to
> > fabricate this module.
> > 
> > In assessing the demands for the size and scope of this project (for a
> > "homebrew" solution) the "show stopper" was all in the  fabrication of
> > the PCB itself.
> > 
> > Here I began my quest for a different "homebrew" solution.
> > 
> > Could I build this module without the complex multi-layer PCB?
> > 
> > Could I interconnect all SMD's (IC's and discrete's) without soldering?
> > 
> > 
> > 
> > Concept proposal:
> > 
> > Start with a blank substrate (metal, glass, FR4,ceramic,etc) in place of
> > a conventional PCB.
> > 
> > Apply double sided releasable 3M "micro adhesive" tape covering the top
> > surface of the substrate.
> > 
> > "Pick and Place" all SMD's onto the top surface of the substrate. Note:
> > with no PCB traces or vias to contend with, a 50% reduction in SMD
> > spacing is obtained.
> > 
> > "Epoxy Pot" the top surface embedding all  the SMD's.
> > 
> > Flip over the substrate (now working from the bottom side) and release
> > the tape and substrate from the potted assembly. Clean off any residual
> > adhesive.
> > 
> > At this point, you should see only the exposed metal contacts of all the
> > SMD's.
> > 
> > Using the modified Epson Artisan 50 printer (set head height to pass the
> > 1/8" thick epoxy pot assembly depth) and print with special UV curable
> > conductive ink (Metalon®)
> > 
> > UV cure (need to build a "homebrew" UV source for curing the conductive
> > ink). The commercial version does it in 3 or 4 seconds.
> > 
> > Subsequent conductive traces (emulating the multi-layers of a
> > conventional PCB) are first "masked out" by printing with a different
> > inkjet of  NON-conducting ink at the conductive trace crossovers.
> > 
> > DONE!  : )
> > 
> > 
> > 
> > [Non-text portions of this message have been removed]
> >
>