.... THIS CD PCB ADAPTER HAS NOW BEEN TAKEN Thank-you! --- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@...> wrote: > > NOTE: > > I have the special metal CD insert for making 2.5" by 3.5" conventional circuit boards made by Full Spectrum Engineering. > > You can read about it here: > http://www.fullspectrumengineering.com/pcbinkjet.html > > Its yours for the asking (FREE) ....just drop me an e-mail or Yahoo IM > > > > > > --- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@> wrote: > > > > > > > > > > > > ..... an example of the conductive traces "reduction" ratio: > > > > 64 pin leadless QFN RFID GEN2 UHF Reader IC with all required SMDs connected (res,caps,inductors,x-tal,etc.) > > > > Conventional multi-layer "PCB" verses "Flip n' Print" > > > > 16 traces reduced to 4 > > 5 traces reduced to 2 > > 5 traces reduced to 2 > > 14 traces reduced to 3 > > 5 traces reduced to 2 > > 23 traces reduced to 10 > > 7 traces reduced to 4 > > 5 traces reduced to 2 > > 6 traces reduced to 3 > > 8 traces reduced to 3 > > 5 traces reduced to 2 > > 6 traces reduced to 3 > > 5 traces reduced to 2 > > > > Totals: > > 110 traces reduced to 41 > > > > Instead of a 5 or 6 layer conventional "PCB" (1.5" by 3/4") only 2 or 3 "printed layers" are needed. > > > > By placing the SMDs "end to end" and "side by side" in combinations, for these connections, you afford essentially a zero "resistive loss",zero "stray inductance and capacitance" and highly conductive soldered connections. > > > > With the now greatly reduced physical length of the "inkjetted conductive traces"(most are only 1/8" to 1/16" long), the higher resistance of the conductive inks now becomes negligible. > > > > In essence, this assembly method uses the SMDs themselves as the majorty of the "wire traces" required. > > > > > > > > > > --- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@> wrote: > > > > > > > > > Hello Homebrew Printed Circuit Group! > > > > > > I have successfully modded my Epson Artisan 50 printer Epson Printer > > > Mod > > > <http://groups.yahoo.com/group/Inkjet_PCB_Construction/photos/album/1664\ > > > 97487/pic/list> to make PCB boards. I did this, as I'm sure as all in > > > this forum, want to quickly build working devices from all the many > > > awesome microchips out there (ie: MCU, RFID,WIFI,GSP, etc.) > > > > > > In my current project, I need to fabricate a "system-in-package" (SIP) > > > module containing an RFID reader chip (QFN), MCU chip and WIFI > > > chip(QFN) on two PCB's (1 1/4" x 3/4") including the required discrete > > > SMD's (resistors, capacitors, inductors, x-tal, etc). > > > > > > This project requires very small SMD's and a very small and dense > > > multi-layer PCB with micro vias for fabrication. > > > > > > This project well exceeds my existing "Homebrew" equipment capability to > > > fabricate this module. > > > > > > In assessing the demands for the size and scope of this project (for a > > > "homebrew" solution) the "show stopper" was all in the fabrication of > > > the PCB itself. > > > > > > Here I began my quest for a different "homebrew" solution. > > > > > > Could I build this module without the complex multi-layer PCB? > > > > > > Could I interconnect all SMD's (IC's and discrete's) without soldering? > > > > > > > > > > > > Concept proposal: > > > > > > Start with a blank substrate (metal, glass, FR4,ceramic,etc) in place of > > > a conventional PCB. > > > > > > Apply double sided releasable 3M "micro adhesive" tape covering the top > > > surface of the substrate. > > > > > > "Pick and Place" all SMD's onto the top surface of the substrate. Note: > > > with no PCB traces or vias to contend with, a 50% reduction in SMD > > > spacing is obtained. > > > > > > "Epoxy Pot" the top surface embedding all the SMD's. > > > > > > Flip over the substrate (now working from the bottom side) and release > > > the tape and substrate from the potted assembly. Clean off any residual > > > adhesive. > > > > > > At this point, you should see only the exposed metal contacts of all the > > > SMD's. > > > > > > Using the modified Epson Artisan 50 printer (set head height to pass the > > > 1/8" thick epoxy pot assembly depth) and print with special UV curable > > > conductive ink (MetalonĀ®) > > > > > > UV cure (need to build a "homebrew" UV source for curing the conductive > > > ink). The commercial version does it in 3 or 4 seconds. > > > > > > Subsequent conductive traces (emulating the multi-layers of a > > > conventional PCB) are first "masked out" by printing with a different > > > inkjet of NON-conducting ink at the conductive trace crossovers. > > > > > > DONE! : ) > > > > > > > > > > > > [Non-text portions of this message have been removed] > > > > > >
Message
Re: Flip n' Print ? (concept proposal for development)
2010-05-26 by Richard
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