Hi Donald, I think your idea of putting a thin wire in a slotted pad could work, but it is going to be a lot of work. A friend of mine also tried to flat the vias (normal ones with a simple piece of wire) with a dremel and did a good job. It is also a lot of work but never did it enought to put an IC on top of those vias. Another idea I have, but not tried yet, is with sodder paste. First try one side, then the other. Or maybe helped with a very thin wire in the hole? Anybody tried something similar? Anyway, some of this "inventions" can work with more o less result, but I'm convinced the way is to go to a quimical or electrolytical plated process. Is there anything affordable for the hobbyier? 2010/12/15 Donald H Locker <dhlocker@...> > > > I have no personal experience. I think a plated-through-holes (PTH) process > is usually a bit beyond the hobbyist level, but is the only way of achieving > no-bulge vias. All other methods (eyelets, fine-gauge wire) leave > protrusions on the surface that prevent flat mounting of components. > > It _might_ be possible to put down a pad with a slot in the copper > (extending radially from the hole) just wide enough to lay a fine gauge wire > in and bridge the pad's slot and the wire with solder, producing a > nearly-flat surface, but I wouldn't want to do many of those. Never mind. > 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch > diameter - that's about a 0.009 inch ridge on the board. > > Donald. > -- > *Plain Text* email -- it's an accessibility issue > () no proprietary attachments; no html mail > /\ ascii ribbon campaign - <www.asciiribbon.org> > > [Non-text portions of this message have been removed]
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Re: [Homebrew_PCBs] Quimical VIAs
2010-12-15 by Vicent Colomar Prats
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