On 23/12/13 23:39, James wrote: > Does anybody actually know what the required (or recommended) adhesion > temperature for typical negative acting dry film is? > > I for some reason thought it was around 70 to 80 degrees, but I've been > experimenting with much lower temperatures (maybe 55 degrees C at the > most) with very good results (I'm using a clothes iron to laminate it > and the temperature is measured on the hot plate as best my thermocouple > will). > > So I'm wondering what the actual necessary temperature is and how cold > can we go before adhesion is compromised, for the clothes iron method > the colder temperature we can use, the better, because of the danger of > blistering the polymer with irons that are too hot. It is commonly 100 or 110degC. If 100degC stuff is done at 110degC it wrinkles, or blisters if there's humidity trapped.
Message
Re: [Homebrew_PCBs] Dry film adhesion temperature
2013-12-23 by Russell Shaw
Attachments
- No local attachments were found for this message.