Silver and Cooper powder or flask with solder mask a the adhesive/aglutinant Both sides should be laminated with something "peelable" prior to drilling Lots of testing to find the right proportions,but I guess more than 90% metals --- In Homebrew_PCBs@yahoogroups.com, "cheater00 ." <cheater00@...> wrote: > > On Tue, Feb 11, 2014 at 1:56 AM, Paul Alciatore <palciatore@...> wrote: > > > > I wonder if adding some powdered metal that does not melt at > > soldering temperatures to the solder paste would help it to coat the > > walls of the via. It may be a question of finding the right alloy and > > the right particle size. You may need different sized particles for > > different size vias. > > Interesting. What's your reasoning why that would help? > > Cheers, > D. >
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Re: No plating through-hole plating
2014-02-11 by psykhon@...
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