--- In Homebrew_PCBs@yahoogroups.com, mpdickens <md30022@y...> wrote: > > --- Ron Amundson <ron_amundson@h...> wrote: > > > > >It's been my experience that epoxy is your friend > > >against harsh environments and climates... > > > > I've used epoxy too, and have filled potting boxes > > with it. However it can > > raise havoc with heat producing parts, as well as > > creating additional > > thermal and conductive paths. However if the > > economic conditions allow it, > > its quite workable except when it comes to service. > > Heat was never an issue when the box is in the water. > The entire box acted as a heat sink. Hoever, we also > did it like this when devices had heat issues and the > unit was not submersed in water: > > -------------------------------- > |epoxy potting | > | ------------ ------- > | | ----------| heat | > | | PCB |componet | sink | > | | ----------| | > | ------------ ------- > | | > -------------------------------- > > The heat sink protrudes from the expoxy and dissapates > the heat. The epoxy itself can dissipate the heat as long as you design enough surface area between the heat sink and the epoxy, and from the epoxy to the water. Water is a great conductor of heat and seawater is pretty cold. Long ago I fixed those overheating C64 power supplies by sawing off the plastic top and epoxying an aluminum heat sink right on top of the epoxy encapsulating everything. I knew it worked well because the base of the heat sink got warm within 20 seconds of turning it on but never got any warmer. In that case things like conductivity made no difference. > > On key thing with some epoxies is that they can > > cause stress related > > failures, eg op amp Vos drift is exagerated with > > temp, and ferrite beads > > really hate the stuff unless you balance their > > coefficient of expansion with > > the epoxy. > > Extruding the heat sink as diagramed above will fix > the op amp problem. Regarding ferrite beads, This is > strange to me. I've hever had an application where > they conducted heat and I cannot think of one. He meant the different rates of expansion as the entire device changes temp. This will not be much of a problem with something in seawater, should be at a pretty constant temp as long as the power producing components are designed to give up their heat pretty efficiently to the seawater. > > The underwater stuff sounds really cool. What did > > you have to do for cases, > > as I imagine the pressure loads were really high. > > The expoxy potting *was* the case. In fact, it was > perfect: Cheap, reliable and never leaked and good to > 1000 Feet. Woods Hole Oceanographic Institute still > does it this way. Pressure was never an issue because > epoxy contracts very little under high pressure. My favorite kind of project box. For my side branch of the thread on low leakage, I may just pot the high impedance part of the circuit if I can find an epoxy encapsulant that has very little conductance. Steve
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Re: how can i prevent corosion?
2003-12-02 by Steve
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