mpdickens wrote: > Epoxy has got to have heat to > cure. Then how do you explain when mixing a < 1 gram of epoxy on the surface of a heavy steel plate that is at room temperature (15 ~ 30\ufffdC) and it still cures relatively ok ? Any exothermic reaction will have nil effect in this situation. There is a lot of info on epoxy here. http://www.dow.com/epoxy/tech/index.htm According to the document titled "DOW Liquid Epoxy Resins" it is the type of curing agent which determines the temperature and rate of cure. The aliphatic amines are the relatively fast room temperature type. There are others which require curing at elevated temperatures, which sounds like the type you once worked with. From what I gather from the document, the curing agents that need more heat and time give you a better cured epoxy resin, i.e. higher service temperature and more resistant to chemicals and solvents.
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Re: [Homebrew_PCBs] Re: how can i prevent corosion?
2003-12-04 by Adam Seychell
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