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Re: [Homebrew_PCBs] Re: tqfp package with TT?

2004-04-09 by Stefan Trethan

On Fri, 09 Apr 2004 22:57:12 -0000, mikezcnc <eemikez@...> wrote:

> Stefan,
>
> I never added cupric chloride and I always use fresh mix due to
> safety reasons. I always have lighting fast etching and I always have
> fumes and lot's of it. The fact that you have no fumes says that you
> have a NEW PROCESS and I would try to duplicate it. You have
> something so new that I checked your date if it is not an April Fool
> joke. What you experience is not possible.
>
> Mike

The bubbles came afer 15 minutes...

It seems the first dose of H2O2 stays in without bubbling because there is 
no
metal solved.

no bubbles where to be seen on the first pcb but later i had them, more 
than enough.

i did 3 pcbs in 2 days without replenishing H2O2 so there was more than 
enough in there.

However, the first pcb showed no bubbles and i could watch the copper 
vanish,
believe it or not.

definitely no new process, did it as ever - i'm just not used to start a 
batch since
it is only my second.

I also measured the density, is well lighter than 1.2 (the scale ends 
there and the hydrometer
stayed floored.
no time fore HCl molarity yet.

ST

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