--- In Homebrew_PCBs@yahoogroups.com, Adam Seychell <a_seychell@y...> wrote: > Anyone here etch with CuCl2 but only rely on air for regeneration ? Just > wondering what other peoples experiences are with this etchant. > > I'm using HCl + CuCl2 at S.G = 1.36 and etch speed appears to be about > 70% of fresh FeCl3 (S.G 1.4) at room temperature. The HCl concentration > I'm running at is approximately 1N (or 40g/l HCl or 1 Moles/liter or > 4%). I found S.G of CuCl2 dramatically effects etch speed. e.g CuCl2 at > S.G of 1.15 was about 10 times slower etch speed than at S.G of 1.35. > Commercially, CuCl2 etchant operates between S.G 1.35 ~ 1.45. > My CuCl is about 1.2 SG and is still pretty slow. no amount of bubbling regens it. H2O2 make all the difference but its still taking abourd 40 minutes to etch a board. The literature I've seen seems to say 1.17 is the target SG. I guess I should dump some more copper in.
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Re: Etchiing with CuCl2 + O2 ?
2005-02-12 by Phil
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