On Fri, 11 Mar 2005 11:33:42 -0500, Earl T. Hackett, Jr. <hacketet@...> wrote: > > The objective in any etching system is to replace the spent etchant at > the > surface of the board with fresh. The speed of the etchant moving doesn't > contribute to the etch rate other than to bring fresh etchant to the > surface. Friction between the etchant and the board surface makes this > quite difficult. This is why spray etching is the best - if you have > enough > of the right spray nozzles to produce a uniform spray pattern. In a > spray > etch 1 oz copper foil will etch in a little over a minute. If you look > inside you'll see why. The etchant is rushing over the board surface at > about a thousand feet per minute. In a bubbler system your lucky to get > to > 50 feet per minute. In an ultrasonic cleaner there is almost no > movement so > all the etchant does is sit there and shake. so that means what? big bubbles are better? spray etchers are awfully complicated to build and i have yet to hear of someone building one that works. Has anyone tried toner transfer with a sprayer? and what about CuCl? ST
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Re: [Homebrew_PCBs] Re: bubbler - more even spread of bubbles
2005-03-11 by Stefan Trethan
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