> 1) C12 is not specified on the BOM but it *is* on the PCB
> (near U3). what
> value cap goes there?
It was originally meant to be a 100n ceramic cap to decouple the RAM
chips.
I dropped it from the BoM because I wasn't certain about the leakage
current - whether it would cause the battery to drain prematurely. But
since then I discovered it would be no problem.
So you can fit it if you like, or not.
> 2) C7 is an electrolytic can, but on the PCB it looks like
> it's supposed
> to be a ceramic disc... except the cathode is marked... ???
That one is an electrolytic - it's square on the silkscreen because I
was thinking of specifying an axial cap, but then couldn't get the legs
far enough apart. I'l change it to a radial symbol next time...
> 3) C15 is supposed to be a ceramic disc, but on the PCB it
> looks like it's
> supposed to be an electrolytic can...
The ceramic C15 was on a prototype board. It was dropped before the
first production run, but I forgot it was on the BoM until round two.
On the round two boards I added the PLED de-coupling cap as C15, which
is a 10uF radial electrolytic.
> 4) are we supposed to screw the voltage regulator down to the
> pcb or just
> bend it down?
It depends on whether your heatsink allows it or not.
If you can fit a screw in there, it's sensible to screw it down.
The heatsinks I use don't have space to get a screw in, so I just bend
the legs over so it all sits in the right place.
Cheers,
Colin f