Lpc2000

--- In lpc2000@yahoogroups.com, "jayasooriah" <jayasooriah@...> wrote:
>
> --- In lpc2000@yahoogroups.com, "derbaier" <dershu@> wrote:
> > Since Philip's seems to have FLASH capabilities on the
> > same die as the logic, it seems logical that they may
> > make use of it for sorting parts with some minor defects.
> 
> Philips does not make use of flash directly, but depend on boot loader
> code to set up the part parameters.  This IMO is strongest reason why
> they have chosen to support boot loader at the binary level, which I
> must say is at considerable expense to themselves.
> 

I will bet that the boot loader code is in FLASH and not in ROM, so of
course, the FLASH is used directly.  It contains the boot loader. In
any case, the boot sequence is tangential to the issue of sorting and
enabling parts based on wafer level testing, and is also not very
relevant to the "free lunch" that you have proposed. If FLASH
technology is actually on the same die as the logic, it also does not
all have to exist directly in ARM's memory space. If it is on a
stacked die, then it would more likely have to all be in ARM's memory
space.

Enough time wasting conjecture for me today!  ;-)

-- Dave