Wiardgroup

> >I would agree that "large format" modules that use a lot of 
metal
> in construction are now too expensive to sustain. However, the
> "small format" modulars which use very little metal in
> construction seem to be doing all right. Every time I order a
> Blacet module, it shows up in three days.<
> 
> I don't think the money is in the panels.  It's the hand soldering 
> that traditionally jacks prices up.  "Small format" modules such 
as 
> Doepfer are cheap because they are outsourced and use a lot 
of 
> machine insertion/soldering (I DROOL over the density of 
some 
> Doepfer boards. It just amazes me).

Having fought this battle, I can assure you the faceplates are a 
very significant source of cost. I can get people to solder. Hand 
soldering is not THAT expensive. Based on my own, and others, 
experience it actually produce a more reliable assembly than 
wave soldering. Wave soldering introduces it's own set of 
problems.

The problem with the faceplates is that they require three 
vendors (at least in Wisconsin). One to produce the actual 
faceplate with holes, one to do the coating (either anodizng or 
painting) and one to do the silkscreening. Each vendor has a 
minimum order (lot charge), tooling and setup charges. If 
anything goes wrong, each will point fingers at the others.

Once you find a vendor that is willing to do 100-200 pieces, you 
have to train them to work to your standards. That costs time and 
money. Once you have them trained, if they can't do it well 
enough, you have to find another vendor, and bear the cost of 
setup, tooling and training all over again.

Then there is the issue of scrap, each step in the process 
produces some scrap parts. Scratched or dropped faceplates, 
smeared ink, spotty anodizing. All of those defects have to be 
scrapped and the cost absorbed by Wiard.

Printed circuit board houses routinely do precision drilling, 
plating and silkscreening from a single vendor. The least 
expensive way to make faceplates would be to make them from 
printed circuit board material (fiberglass). You could put a 
continuous ground plane on one layer for sheilding, and use 
black solder mask on the dress face with white silkscreening. 
The cost would likely be a tenth of the same metal faceplate. But 
I do not know if the market place would accept them.

> Shun the Fracrack and shun it NOW. It is an obligation...nay, 
my 
> SACRED DUTY to talk you out of the Fracrack format. There is 
much to 
> admire about Blacet, but not the format, which is 
trancendentally 
> horrid.

The Frac-Rac format is the American imperial units equivalent of 
the DIN metric format. Lots of instrumentation is produced in this 
format.

It is no longer a question of producing an ideal modular. It is a 
question of continuing to produce a usable, affordable modular 
with reasonable lead times for delivery.

The Frac-Rac format suits this purpose. There are racks and 
power supplies available off the shelf. The Blacet PS-500 
supports both 110 and 220 VAC input voltages for global use. All 
of the basic modules are available in this format. The systems 
are light in weight, portable and fit perfectly in the SKB "X" cases.

I would prefer a larger faceplate, it gives me more options as a 
designer, but the Frac-Rac format is friendlier to the customer on 
a variety of levels.