I had a conversation with one of the design minds behind Apogee Analog/Digital Convertors a few months ago that reflects much of the same thought - Apogee has even considered buying on Ebay used AD8000 convertors in an effort to reclaim parts that are no longer in production since the AD8000 was in production a few years ago, in an effort to have parts in stock to repair units that are brought in for repair. 'Oh, curse that unit that has lasted longer than a few years!" He admitted that the state of the art was "disposible electronics: - on the shelf this year, but gone forever in a few. So it seems that Grant is right - there is no real guarantee that if Wiard 300 goes SO that the SMD components needed will be available in a few years. gary "Grant Richter" <grichter@...> wrote: > > What is truely shocking is that SO (small outline) SMD devices are going EOL (end of life) in > as short as two years. SMD seem like it will have the same problem as early eight bit > digital. The rate of change is very highly accelerated. 2708 EPROMs are still available, but > you need an old programmer to recognize them. > > It is beginning to look like the safest design strategy is to us a mix of thru hole and SMD. > It appears DIP packs are sticking around longer than some SO chips which are already > obsoleted. > > Lead bearing technology is a know factor, while lead reduced technology is still a big > question mark. And once again, car and motorcycles batteries and stained glasses > windows in churches represent thousands of time more evironmental lead contribution > that Wiard could possibly make in it's entire existance. > > > --- In wiardgroup@yahoogroups.com, "Gary Chang" <gchang@> wrote: > > > > I would like to add to Doc's eloquent incites that many devices, such > > as the Sequentix P3 sequencer, (which has been a rather large success > > in the thru-hole era), could not be converted to the newer technology > > in a way that was econimically realistic for its market place - and, > > because of the EU's ban on such leaded devices being manufactured, has > > now ended production. > > > > At the very least, conversion of the 300 series to SMD would be very > > costly - period. Grant has already employed this technology on his > > more recent devices (1200 series) - I suspect that he will continue to > > do this in the future. > > > > As for the "archival" 300 Series Modules that exist, I think that it > > would be safe to assume that even at twice the price for components, a > > 300 Series module is still more affordable to build today in its > > existing design than turning it into a "TBD" module, pending the > > costly and uncertain conversion to SMD, which would turn this cash cow > > into a cash drain.... > > > > that''s just my opinion - I could be wrong. > > > > > > gary > > > > > > > > > > > > "drmabuce" <drmabuce@> wrote: > > > > > > Hi all > > > > > > --- In wiardgroup@yahoogroups.com, "tom_tav" <tom_tav@> wrote: > > > > > > > > Unfortunately if you want to service an instrument somedays you will > > > sooner or later having > > > > problems to get something else then smd parts.... > > > > > > > > > > this is true, but the decision for a technological cottage industry is > > > anything but clear right now... > > > > > > a few questions about surface-mount technology are stacking up in my > > > mailbox so here's my take: > > > > > > background: > > > SMD,SMT,SOIC are all jargon for pretty-much the same thing: > > > itty bitty parts that you can move with a sneeze and don't have any > > > nice bendy wires stickin' out of 'em. > > > the wiki on this subject is pretty good > > > http://en.wikipedia.org/wiki/Surface-mount_technology > > > These things are made for the convenience of robots and not for human > > > fingers. > > > > > > More germane to this forum is the issue of reparability. It's true > > > that the older DIP devices will suffer from a scarcity of replacement > > > parts. But this evolutionary precipice in hardware is a bit unique in > > > that the components are virtually identical electrically but they are > > > physically much smaller. In this way this is not like the migration > > > from tubes to discrete transistors. The scale of physical > > > miniaturization was comparable but power environments moved from high > > > voltage unipolar to lower voltage bipolar and the active components > > > had VERY different electrical properties. > > > SMD is optimized for mass production by automated processes. Component > > > level repairs are not part of the plan. The intention is to reduce the > > > cost of the circuitboard to the point that replacement is cheaper than > > > repair. This works pretty well for cell phones produced in production > > > runs of 50,000 units but those scales do not favor small run esoteric > > > devices. Small run SMD boards don't run cheap enough to garner the > > > advantage of being disposable and replaceable. > > > Component-level repairs to SMD are possible but significantly more > > > difficult and time consuming . i'd contend that the profile of > > > increased risk and difficulty of SMD repair is different but > > > equivalent to the tradeoffs inherent in through-hole (DIP) (ie. easier > > > repairs but scarcer parts). In a pinch I think it is easier to adapt a > > > smaller SMD chip to a through-hole application than the reverse. > > > > > > The wiard designs (what's on the schematic) are very durable but the > > > technology available to realize these 'songs in solder' is in a real > > > state of flux right now.*** The consequences of the choices that face > > > Prof. Richter (and his colleagues) at this juncture are VERY serious, > > > and there is no path that offers a CLEAR advantage right now. > > > > > > aleatoric music is way more fun than aleatoric livelihoods. > > > > > > -doc > > > > > > PS > > > apologies to the group for all the button-thrashing empty posts this > > > morning > > > > > > *** > > > even -i- don't KNOW if that pun was intended or not > > > > > >
Message
to SMD or not to SMD (was Re: 300 series back in full production)
2007-03-25 by Gary Chang
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