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Digital BW, The Print

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RE: [Digital BW] Re: Possible MIS 2400 inks - Little Gob of Sticky Goo

2005-10-09 by John Moody

Clayton,
I would be nervous about potential printer contact damage if the chip is not
sitting properly and securely.
What I would do is sand down the encapsulant bump until it can sit properly
in the cartridge.  If you go too far and ruin the chip, MIS might give you a
new one.  ItÂ’s better than asking them to repair your printer.
For technique, I would put the sandpaper face up on a flat hard surface, and
use something like a magic rub eraser to help hold it parallel while sanding
it down.  If you have to buy sandpaper, 220 grit should be good.  Good luck.

Best regards,
John Moody

-----Original Message-----
From: DigitalBlackandWhiteThePrint@yahoogroups.com
[mailto:DigitalBlackandWhiteThePrint@yahoogroups.com]On Behalf Of Clayton
Jones
Sent: Saturday, October 08, 2005 10:41 PM
To: DigitalBlackandWhiteThePrint@yahoogroups.com
Subject: [Digital BW] Re: Possible MIS 2400 inks - Little Gob of Sticky Goo

Hello greg,

>>why not try a little dollop of 5 minute epoxy?

>I've read of someone using double sticky foam tape, which should give
>the added benefit of a "spring" loaded pressure source. The only
>problem I can think of would be if the chips shifts position and the
>contacts do not line up.

I agree the "spring loaded" idea might be better, because it might
allow it to self-adjust to mate with the pins.  Once the epoxy
hardens, if the chip is crooked there's no way it can shift when the
cart in inserted.  I was real worried when I first tried it using the
MIS little gob of sticky goo because the chip could wiggle a bit, but
it worked fine.

Hmmm..."little gob of sticky goo"...that's sort of, ummm, poetic or
something.  I think I'll put it in the title <g>.

Regards,
Clayton




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