Doepfer

I'm not familiar with the Doepfer VMS. It looks like it would fit the 
bill. I imagine the lack of CEM parts is the reason theses are no 
longer being built. Too bad, the CEM ICs or tech like then sure allow 
for smaller PCB designs for sure.
-J
_________________________________________
James Husted
The ErsatZ Planet Graphics and Sound
www.ersatzplanet.com
james@ersatzplanet.com
_________________________________________
"Welcome to the first day of the rest of your money..."
On Jun 19, 2004, at 3:55 PM, TonyBlack [JohnnyBusca] wrote:

> I also like to see a voice card.
>
> I was able to buy a Doepfer VMS voicecard based on CEM33x0s. Right now
> it's being fixed, but I'm very happy with it..
>
> (picture of the VMS in the upperleft corner:
> http://www.tonyblack.org/images/allmodular.jpg )
>
> Scanned circuits:
> http://www.synrise.de/user/user_8.htm
>
> Best regards,
> Johnny
>
>
>> Message: 19
>>    Date: Fri, 18 Jun 2004 20:58:17 -0700
>>    From: James Husted <james@ersatzplanet.com>
>> Subject: module Ideas...
>>
>> 1) I would love to see a dedicated "voice module", something like a
>> Oberheim SEM module. It could even be made of current modules just
>> packaged into a single smaller panel. It would have a similar feature
>> set as a SEM, 2 VCOs (switchable or mixable at the filter 
>> wave-shapes),
>> a simple LFO (maybe with switchable wave-shapes - VC not even needed),
>> 2 Envelope generators (ADSRs not ASRs like the SEM unless the size
>> restricts it to ASR), a Multimode filter, and a VCA (or a stereo
>> panner/VCA) all with simple inputs and outputs normalized to a 
>> standard
>> mono voice patch. The minimum patching needed would be a single CV and
>> Gate, but the normalization could be broken to make available separate
>> CVs for the VCOs and VCF, and gates for the different EGs. The main
>> thing is to make the feature set is flexible with a emphasis on small
>> size. There are many times where a "standard" voice architecture is
>> useful and the ease of patching would be great. The development time
>> would be minimal since the modules used have all been developed
>> already. It is just a packaging exercise.
>>
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