Homebrew PCBs

--- In Homebrew_PCBs@yahoogroups.com, "Herbert E. Plett"
<cachureos@...> wrote:
>
> 
> 
> --- sethkoster <sethkoster@...> wrote:
> > Hmm...   It occurs to me that since I was moving the iron the very
> > same problem could have happened during the re-fusing phase.   Perhaps
> > because the PCB is heating up and cooling down in areas as I move the
> > iron around it is exacerbating this problem.
> > 
> 
> don't think so. copper will not heat up and cool down, less stretch
while
> ironing.
> I am nearer to believe it's a too low temperature or board prep problem.
> use the iron very hot (over 200C, 400F) and use a paper towel
buffer. should
> yellow slightly...
> 
> 

I think it was a pressure problem.   I tested my iron before and the
hottest it gets is just under 350F, but the other day when I got my
.032" boards and laminator I was able to do a better transfer.

The laminator itself does not get hot enough, if I run the board
through it the toner doesn't even adhere slightly to the board, but if
I iron it to heat it then run it through the laminator and repeat the
process a few times I can get a solid looking transfer.

But after etching I still find areas where the porosity of the toner
creates opens in traces.

I think I need some sort of sealant for the toner.