----- Original Message ----- From: "Matthew Smith" <matt@...> To: <Homebrew_PCBs@yahoogroups.com> Sent: Thursday, June 05, 2008 12:08 AM Subject: [Homebrew_PCBs] "How to succeed the first time with ultra-small QFN packages" > Hi Folks > > I know that under-chip pads were mentioned recently, so I thought that I > would pass on this link from the TimeNuts mailing list: > > Article: > "How to succeed the first time with ultra-small QFN packages" > <http://www.wirelessnetdesignline.com/showArticle.jhtml?articleID=202800018> > > Whilst the article describes the use of a solder stencil, I am sure that > this technique could be reproduced manually, given good magnification > and a steady hand. > > Then all ready for the toaster oven or hotplate! For prototypes I just use a large via and feed solder in manually with the tip of the soldering iron. Leon -- Leon Heller Amateur radio call-sign G1HSM Yaesu FT-817ND transceiver Suzuki SV1000S motorcycle leon355@... http://www.geocities.com/leon_heller
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Re: [Homebrew_PCBs] "How to succeed the first time with ultra-small QFN packages"
2008-06-05 by Leon
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