Hi Folks I know that under-chip pads were mentioned recently, so I thought that I would pass on this link from the TimeNuts mailing list: Article: "How to succeed the first time with ultra-small QFN packages" <http://www.wirelessnetdesignline.com/showArticle.jhtml?articleID=202800018> Whilst the article describes the use of a solder stencil, I am sure that this technique could be reproduced manually, given good magnification and a steady hand. Then all ready for the toaster oven or hotplate! Cheers M -- Matthew Smith Smiffytech - Technology Consulting & Web Application Development Business: http://www.smiffytech.com/ Personal: http://www.smiffysplace.com/ LinkedIn: http://www.linkedin.com/in/smiffy
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"How to succeed the first time with ultra-small QFN packages"
2008-06-04 by Matthew Smith