I have operated a plating pcb line in the past. The people there just buy a box of chemicals from a supplier and made the boards. The chemical supplier just ripped the manufacturers name from the chemical label and placed their own name. This chemical sets are available from many places (locally cost 400eur) and are easy to operate, the machine is just some plastic tanks with 2 of them heated, one with air pump and a 3-6V 40A psu, and a simple agitation moving the board holder from left to right and back again. I never read what was on Markus Zingg's page or others but the chemical set seems easy to understand and from a lot of what i am been reading it seems easy to make all the chemicals from any local store. From car anti-freezer, ammonium, caustic soda, fine table salt, hydrochloric acid, tin solder wire, wine pH neutraliser, sulphuric acid, copper parts and a fertilizer bag (just the plastic bag clean for filter). I think it can be done but still didn't test. It has a resin desmear bath made with resin etch and solvent to etch fr4 resin inside the hole in a two components complex of anti-freezer, a bath to kill the remaining of the first based on acid salt, a activation bath made with tin colloidal, a ph neutraliser and the normal sulphuric acid copper plating with phosphorizated copper and anode bags. From what i understand of course. The secret is making the holes electrical conductive before copper plating. Another thing is the copper anode bags, they act as filters. If not used the copper is plated in big chunks and deposits on tank, eating the copper anode in less than 50% efficiency. I will make some tests and give them here, but from http://nr.stpi.org.tw/ejournal/proceedingA/v23n3/365-368.pdf You can read was used in the past tin lead colloidal as activation bath, so my idea is put pieces of tin/lead solder wire in hydrochloric acid let the solder dissolve in bath add water to make 1% acid solution and place the drilled and clean board there for 5min. Then try to plate in the sulfuric acid copper bath at 30mA per square cm by half hour and see if the copper plates inside the holes. Simao Juan, How to use it greatly depends on the chemistry used. The chemistry even defines howmany tanks you need, wether they are heated, the processing parameters etc. etc. My best advice to you is to first organize a chemistry, cause it's supplier will be able to tell you the processing requierements. Then build your station along them. HTH Markus Juan EA7FNJ schrieb: > > Hi guys! > > Ok, great machine! but, I can see how to make one but, where is the > manual 'how to use it'? > > xD > > --- In Homebrew_PCBs@yahoogroups.com > <mailto:Homebrew_ PCBs%40yahoogroups.com>, "Steve" <alienrelics@...> wrote: > > > > Have you checked the Links under "Plated Through Holes" yet? Not many > > links there, but it is something. Markus Zingg's page on through hole > > plating has been down for a while, but I just found where someone > > mirrored it and put that link in place of the missing site. > > > > http://tech.groups.yahoo.com/group/Homebrew_PCBs/links > <http://tech.groups.yahoo.com/group/Homebrew_PCBs/links> > > > > If you find any other links on through-hole plating, please place them > > there. > > > > Steve Greenfield
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Re: [Homebrew_PCBs] Re: Electroplating and VIAs
2009-01-19 by Simão Pedro Cardoso
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