Kim Vellore wrote: > > > Wondering why this would be faster than dipping the board in FeCl > > Kim Unlike persulfates, the FeCl3 and CuCl2 etch reactions produce relatively insoluble copper(I) chloride at the surface, which acts as a barrier for further etching. Because its a precipitate (as opposed to ions), it doesn't easily diffuse into the bulk solution. You can see this copper(I) chloride as streaks of white solid when you pull the copper out of etchant and hold it for 30 seconds. From my experience, I found there isn't much speed improvement between decent bubble assisted agitation and manual brushing the PCB surface. Adam
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Re: [Homebrew_PCBs] Re: instructables 1 min PC etch using sponge & FeCl
2009-08-15 by Adam Seychell