--- In Homebrew_PCBs@yahoogroups.com, Henry Liu <henryjliu@...> wrote: > > I have done some detailed thinking about fastest assembly for prototypes. > > I have still yet to find something better than Zeph paste in a syringe > + hot air. There's a video here for a QFP: > http://www.zeph.com/zephpaste.htm > > Hot Air Operations: > i) Paste 4 sides of chip, 10seconds per side > > Total Time: 40 seconds and no cleanup. Fast! I guess it is a style decision for them to use that shape of base for everything, but it sure does seem excessive for the vacuum pick-and-place. Simple enough to build the pre-heater. I don't see this system working well for BGA reflowing, unless that hot air tip can put out a lot more heat than it looks like it can. Someone gave me an Xbox with the red-ring-of-death, you see... Steve Greenfield
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Re: Cheap SMD oven, anyone?
2010-03-12 by alienrelics
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