Here is the second try result. This time it covered better the via holes, especially the one in the large pads - talking about headers rows etc - 20 mils holes. What I did: - etch the board (toner transfer - no need to explain) - scotch tape over - drill (again check every hole to be clean and deburr) - squeegee nickel print on one side then vacuum on the other - do same on the other side (so I did both sides) - take scotch off - bake - test (big holes good, small holes less than 50%) This time I made the print more fluid (almost like ink). Indeed no big chunks anymore in the big holes (20 mils), the through vias (10 mils).. still clog. I believe the nickel it dries way too fast. Tin plate ... TIN does not adheres to the nickel as I expected so the board looks ugly (but who cares if it works). But the same happens with solder. I think you need real copper electroplating. Overall I think this Nickel thing is not worth the fight. Maybe Silver Print :)) ... but that is 40$ a tiny jar. Final verdict.. this Nickel thing is getting on my nerves :)) and is messy. I will stick for now with the copper wire soldered and then cut flush. If I am in the mood to make it look good I polish the solder joint with a soft stone to make it even more flush. This polishing thing does makes the through vias look darn nice, but you can imagine is a time killer :)) --- In Homebrew_PCBs@yahoogroups.com, DJ Delorie <dj@...> wrote: > > In the video tutorials I've seen of similar products, they squeegie and > vaccum from *both* sides - first side A to side B, then side B to side A. >
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Re: Nickel and Silver Print from MG for through hole plating
2010-08-20 by morarcalin
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