On Mon, Oct 4, 2010 at 6:39 AM, Howard Chester <howard.chester@...>wrote: > > > Hello Steve, Does your PCB package Have a thermal relief setting in the > copper fill function? > By using this function when doing the copper fill in PCB layout helps when > soldering by stopping the heat from your soldering iron being shunted to the > ground plane. > You should have various options in copper fill(also called copper pour) to > select the thermal relief settings, eg. size, number of spokes, separate > settings for SMD devices etc. > If your package does not have these settings check out the free DIPTrace > schematic and PCB package (300 pin limit) at > http://diptrace.com > Hope this is of some help with your current problem, chester > EagleCAD also allows you to enable thermal relief patterns on copper fills/pours, and I'd highly recommend it for any homebrew work. To enable it, get info on your fill polygon, and check the "Thermals" checkbox. -Andrew [Non-text portions of this message have been removed]
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Re: [Homebrew_PCBs] Trouble with through hole pads connected to plane
2010-10-04 by Andrew Villeneuve
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