And so does Kicad ... Maybe we should ask which -- if any -- commonly used PCB programs do NOT include thermal relief options? :) --- In Homebrew_PCBs@yahoogroups.com, Andrew Villeneuve <andrewmv@...> wrote: > > On Mon, Oct 4, 2010 at 6:39 AM, Howard Chester <howard.chester@...>wrote: > > > > > > > Hello Steve, Does your PCB package Have a thermal relief setting in the > > copper fill function? > > By using this function when doing the copper fill in PCB layout helps when > > soldering by stopping the heat from your soldering iron being shunted to the > > ground plane. > > You should have various options in copper fill(also called copper pour) to > > select the thermal relief settings, eg. size, number of spokes, separate > > settings for SMD devices etc. > > If your package does not have these settings check out the free DIPTrace > > schematic and PCB package (300 pin limit) at > > http://diptrace.com > > Hope this is of some help with your current problem, chester > > > > EagleCAD also allows you to enable thermal relief patterns on copper > fills/pours, and I'd highly recommend it for any homebrew work. > > To enable it, get info on your fill polygon, and check the "Thermals" > checkbox. > > -Andrew > > > [Non-text portions of this message have been removed] >
Message
Re: Trouble with through hole pads connected to plane
2010-10-04 by Andrew
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