Lpc2000

--- In lpc2000@yahoogroups.com, Greg Deuerling <egads@f...> wrote:
> I use a hot air re-work machine and it does a great job.  The 
> great things about BGA's are they are self centering.  They can be
> off pad up to 60% and when the balls flow they will pull the 
> package into proper alignment.   For a big production run you want
> to go to a place that does IR re-flow, but for the qnt we do here 
> our hot air machine work nicely.  It's not all that
> hard!!!

We used hot air blower (600W SMT rework/desodlering tools) to solder 
BGA on prototype boards but could only get 20-30% successful rate.
Difficult part would be chip blown completely out of PCB footprint.
Self-centering does not always pull the chip back to proper alignment
also.   Any special skill/experience to share??
Regards