Lpc2000

----- Original Message ----- 
From: "unity0724" <unity0724@...>
To: <lpc2000@yahoogroups.com>
Sent: Tuesday, January 31, 2006 1:20 PM
Subject: [lpc2000] Re: Philips LPC3180 - BGA loading Qs


> --- In lpc2000@yahoogroups.com, Greg Deuerling <egads@f...> wrote:
>> I use a hot air re-work machine and it does a great job.  The
>> great things about BGA's are they are self centering.  They can be
>> off pad up to 60% and when the balls flow they will pull the
>> package into proper alignment.   For a big production run you want
>> to go to a place that does IR re-flow, but for the qnt we do here
>> our hot air machine work nicely.  It's not all that
>> hard!!!
>
> We used hot air blower (600W SMT rework/desodlering tools) to solder
> BGA on prototype boards but could only get 20-30% successful rate.
> Difficult part would be chip blown completely out of PCB footprint.
> Self-centering does not always pull the chip back to proper alignment
> also.   Any special skill/experience to share??

An electrically heated skillet is supposed to be very good, although I 
haven't heard of anyone using one with BGAs. It does work OK with QFN 
packages, which are similar. I've bought a cheap toaster oven which I was 
intending to use with a controller, but the skillet is supposed to be 
better.

Leon