Lpc2000

Oven/Skillet might work.  But foresee hard to control timing and
temperature.  Hee, You seem like having some "weird" ideas as me of
using home appliances for prototyping...  
- fridge/oven for reliability/environmental testing
- dish washer for PCB washing.   (I'm using a tank with an aquarium
  pump for washing water-soluble flux/solder, works fine)
- Oven for removing moisture on PCB before soldering

Pls eMail me your procedure when you can get your BGA mounting
successful and thanks.   Most chips will be on BGA in future... :(
Regards

--- In lpc2000@yahoogroups.com, "Leon Heller" <leon.heller@...> 
wrote:
>
> ----- Original Message ----- 
> From: "unity0724" <unity0724@...>
> To: <lpc2000@yahoogroups.com>
> Sent: Tuesday, January 31, 2006 1:20 PM
> Subject: [lpc2000] Re: Philips LPC3180 - BGA loading Qs
> 
> 
> > --- In lpc2000@yahoogroups.com, Greg Deuerling <egads@f...> 
wrote:
> >> I use a hot air re-work machine and it does a great job.  The
> >> great things about BGA's are they are self centering.  They can 
be
> >> off pad up to 60% and when the balls flow they will pull the
> >> package into proper alignment.   For a big production run you 
want
> >> to go to a place that does IR re-flow, but for the qnt we do 
here
> >> our hot air machine work nicely.  It's not all that
> >> hard!!!
> >
> > We used hot air blower (600W SMT rework/desodlering tools) to 
solder
> > BGA on prototype boards but could only get 20-30% successful 
rate.
> > Difficult part would be chip blown completely out of PCB 
footprint.
> > Self-centering does not always pull the chip back to proper 
alignment
> > also.   Any special skill/experience to share??
> 
> An electrically heated skillet is supposed to be very good, 
although I 
> haven't heard of anyone using one with BGAs. It does work OK with 
QFN 
> packages, which are similar. I've bought a cheap toaster oven 
which I was 
> intending to use with a controller, but the skillet is supposed to 
be 
> better.
> 
> Leon
>