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Message

Re: LPCC footprint and assembly

2004-02-09 by Jim Beagley

--- In lpc2100@yahoogroups.com, "leon_heller" <leon_heller@h...> wrote:
> Being the proud posessor of one of the LPCC-packaged versions of the
> LPC2106 that Philips has been giving away as samples (thanks, Dave),
> I've been trying to find information on the recommended PCB land
> pattern. I eventually found it on the web site of the company who
> makes the package and have uploaded it to the group's File area:
lpcc.pdf.
> 
> It looks as though it really requires similar assembly techniques to
> those used for BGA devices, but it might be do-able using a fine tip.
> The ADI ADXL202 accelerometer uses a somewhat similar package (only
> eight pads, though) and I have successfully soldered one of those to a
> home-made PCB.
> 
> Leon

Leon,
 A method I use to solder these packages is to use your finest tip,
then take a small piece of wire, cut it at an angle so the tip is
sharp, then use that as a wedge to get the solder to bridge the pin to
 the pad.

 Also, bring the pads out from under the part a few mills further than
suggested, then move them back to go into production.

 The most succesfull, process I have used is a stencil, and solder
paste, then just heat the part from the top (hot air gun), when it
flows, let it cool, then use the afore mentioned method to remove any
bridges, or make unsuccesfull connections.

Jim

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