Lpc2000

Being the proud posessor of one of the LPCC-packaged versions of the
LPC2106 that Philips has been giving away as samples (thanks, Dave),
I've been trying to find information on the recommended PCB land
pattern. I eventually found it on the web site of the company who
makes the package and have uploaded it to the group's File area: lpcc.pdf.

It looks as though it really requires similar assembly techniques to
those used for BGA devices, but it might be do-able using a fine tip.
The ADI ADXL202 accelerometer uses a somewhat similar package (only
eight pads, though) and I have successfully soldered one of those to a
home-made PCB.

Leon

> Being the proud posessor of one of the LPCC-packaged versions of the
> LPC2106 that Philips has been giving away as samples (thanks, Dave),

Don't thank me.  You gave me three of the normal packaged one, I
owe you, man. :)  You're quite welcome to it.

> It looks as though it really requires similar assembly techniques to
> those used for BGA devices, but it might be do-able using a fine tip.
> The ADI ADXL202 accelerometer uses a somewhat similar package (only
> eight pads, though) and I have successfully soldered one of those to a
> home-made PCB.

You could use a teflon board and the hotplate soldering techniqure
that the RF boys use.  It heats the whole thing up and will reflow
nearly anything with flux on it that gets near solder.

Good luck!

Cheers,
David

David Willmore wrote:

> > Being the proud posessor of one of the LPCC-packaged versions of the
> > LPC2106 that Philips has been giving away as samples (thanks, Dave),
>
> Don't thank me.  You gave me three of the normal packaged one, I
> owe you, man. :)  You're quite welcome to it.
>
> > It looks as though it really requires similar assembly techniques to
> > those used for BGA devices, but it might be do-able using a fine tip.
> > The ADI ADXL202 accelerometer uses a somewhat similar package (only
> > eight pads, though) and I have successfully soldered one of those to a
> > home-made PCB.
>
> You could use a teflon board and the hotplate soldering techniqure
> that the RF boys use.  It heats the whole thing up and will reflow
> nearly anything with flux on it that gets near solder.
>
> Good luck!
>
> Cheers,
> David
>
    Or just use a hot air pencil, something like a Edsyn.  Put a little 
solder paste down on the pads, position the part, hold it in place with 
a pick, run the pencil around it a few times.  Works with MLF parts.

    --jc

Hi:

If the LPC2106 will come in LPCC package, may we use a  socket 
adapter for through-hole PCB?

SOmeone knows when this package will be available?

Thanks;

Gus



--- In lpc2100@yahoogroups.com, "J.C. Wren" <jcwren@j...> wrote:
> David Willmore wrote:
> 
> > > Being the proud posessor of one of the LPCC-packaged versions 
of the
> > > LPC2106 that Philips has been giving away as samples (thanks, 
Dave),
> >
> > Don't thank me.  You gave me three of the normal packaged one, I
> > owe you, man. :)  You're quite welcome to it.
> >
> > > It looks as though it really requires similar assembly 
techniques to
> > > those used for BGA devices, but it might be do-able using a 
fine tip.
> > > The ADI ADXL202 accelerometer uses a somewhat similar package 
(only
> > > eight pads, though) and I have successfully soldered one of 
those to a
> > > home-made PCB.
> >
> > You could use a teflon board and the hotplate soldering techniqure
> > that the RF boys use.  It heats the whole thing up and will reflow
> > nearly anything with flux on it that gets near solder.
> >
> > Good luck!
> >
> > Cheers,
> > David
> >
>     Or just use a hot air pencil, something like a Edsyn.  Put a 
little 
> solder paste down on the pads, position the part, hold it in place 
with 

> a pick, run the pencil around it a few times.  Works with MLF parts.
> 
>     --jc

----- Original Message ----- 

From: "gustavo_sagasti" <gustavo_sagasti@...>
To: <lpc2100@yahoogroups.com>
Sent: Saturday, February 07, 2004 1:18 PM
Subject: [lpc2100] Re: LPCC footprint and assembly


> Hi:
>
> If the LPC2106 will come in LPCC package, may we use a  socket
> adapter for through-hole PCB?

Test sockets are made for this package (as they are for BGA) but they will
be very expensive. According to the LPCC.pdf doc:

"Test sockets are supplied by various vendors
such as Synergetix, Johnstech, Evertech and
M & M. Burn-in sockets are available from
Loranger (Kelvin contact capable) and
Plastronics."

They are probably through-hole.

Leon

Leon Heller, G1HSM
Email: aqzf13@...
My low-cost Philips LPC210x ARM development system:
http://www.geocities.com/leon_heller/lpc2104.html

this is getting mysterious...
philips in her November 2003 linecard
http://my.semiconductors.philips.com/acrobat/literature/9397/75012354.pdf
does not list any LPCC or HVQFN devices for LPC210X line
i've searched, i could not find reference in current datasheets and user
manuals for other than LQFP48 package!

joseph

----- Original Message ----- 

From: "gustavo_sagasti" <gustavo_sagasti@...>
To: <lpc2100@yahoogroups.com>
Sent: Saturday, February 07, 2004 8:18 AM
Subject: [lpc2100] Re: LPCC footprint and assembly


> Hi:
>
> If the LPC2106 will come in LPCC package, may we use a  socket
> adapter for through-hole PCB?
>
> SOmeone knows when this package will be available?
>
> Thanks;
>
> Gus
>
>
>
> --- In lpc2100@yahoogroups.com, "J.C. Wren" <jcwren@j...> wrote:
> > David Willmore wrote:
> >
> > > > Being the proud posessor of one of the LPCC-packaged versions
> of the
> > > > LPC2106 that Philips has been giving away as samples (thanks,
> Dave),
> > >
> > > Don't thank me.  You gave me three of the normal packaged one, I
> > > owe you, man. :)  You're quite welcome to it.
> > >
> > > > It looks as though it really requires similar assembly
> techniques to
> > > > those used for BGA devices, but it might be do-able using a
> fine tip.
> > > > The ADI ADXL202 accelerometer uses a somewhat similar package
> (only
> > > > eight pads, though) and I have successfully soldered one of
> those to a
> > > > home-made PCB.
> > >
> > > You could use a teflon board and the hotplate soldering techniqure
> > > that the RF boys use.  It heats the whole thing up and will reflow
> > > nearly anything with flux on it that gets near solder.
> > >
> > > Good luck!
> > >
> > > Cheers,
> > > David
> > >
> >     Or just use a hot air pencil, something like a Edsyn.  Put a
> little
> > solder paste down on the pads, position the part, hold it in place
> with
> > a pick, run the pencil around it a few times.  Works with MLF parts.
> >
> >     --jc
>
>
>
>
> Yahoo! Groups Links
>
>
>
>
>

----- Original Message ----- 

From: "Joseph Tapay" <Joseph.Tapay@...>
To: <lpc2100@yahoogroups.com>
Sent: Sunday, February 08, 2004 4:16 PM
Subject: Re: [lpc2100] Re: LPCC footprint and assembly


> this is getting mysterious...
> philips in her November 2003 linecard
> http://my.semiconductors.philips.com/acrobat/literature/9397/75012354.pdf
> does not list any LPCC or HVQFN devices for LPC210X line
> i've searched, i could not find reference in current datasheets and user
> manuals for other than LQFP48 package!

They do mention it here:

http://www.semiconductors.philips.com/acrobat/literature/9397/75012193.pdf

in connection with the LPC2124. It isn't in the LPC2124 data sheet, though.
It is strange that it isn't mentioned in the LPC2106 data sheet either,
because I definitely do have a chip in that package. Both would go nicely
with the new NordicRF nRF905 radio chip, which is in a similar package.

Leon
--
Leon Heller, G1HSM
Email: aqzf13@...
My low-cost Philips LPC210x ARM development system:
http://www.geocities.com/leon_heller/lpc2104.html

yes, strange,
on philips's site
http://www.semiconductors.philips.com/products/
General Product Info/Package Info (javascript)
search for LPCC has no results

7X7 HVQFN48 packages are listed
http://www.semiconductors.philips.com/package/SOT619-1.html
http://www.semiconductors.philips.com/package/SOT619-2.html
http://www.semiconductors.philips.com/package/SOT619-3.html
http://www.semiconductors.philips.com/package/SOT619-4.html
6X6 HVQFN48 package listed
http://www.semiconductors.philips.com/package/SOT778-1.html

which one is yours Leon?
how can it be, samples with no specs?

joseph





----- Original Message ----- 
From: "Leon Heller" <leon_heller@...>
To: <lpc2100@yahoogroups.com>
Sent: Sunday, February 08, 2004 12:32 PM
Subject: Re: [lpc2100] Re: LPCC footprint and assembly


>
> ----- Original Message ----- 
> From: "Joseph Tapay" <Joseph.Tapay@...>
> To: <lpc2100@yahoogroups.com>
> Sent: Sunday, February 08, 2004 4:16 PM
> Subject: Re: [lpc2100] Re: LPCC footprint and assembly
>
>
> > this is getting mysterious...
> > philips in her November 2003 linecard
> >
http://my.semiconductors.philips.com/acrobat/literature/9397/75012354.pdf
> > does not list any LPCC or HVQFN devices for LPC210X line
> > i've searched, i could not find reference in current datasheets and user
> > manuals for other than LQFP48 package!
>
> They do mention it here:
>
> http://www.semiconductors.philips.com/acrobat/literature/9397/75012193.pdf
>
> in connection with the LPC2124. It isn't in the LPC2124 data sheet,
though.

> It is strange that it isn't mentioned in the LPC2106 data sheet either,
> because I definitely do have a chip in that package. Both would go nicely
> with the new NordicRF nRF905 radio chip, which is in a similar package.
>
> Leon
> --
> Leon Heller, G1HSM
> Email: aqzf13@...
> My low-cost Philips LPC210x ARM development system:
> http://www.geocities.com/leon_heller/lpc2104.html
>
>
>
> Yahoo! Groups Links
>
>
>
>
>

----- Original Message ----- 

From: "Joseph Tapay" <Joseph.Tapay@...>
To: <lpc2100@yahoogroups.com>
Sent: Sunday, February 08, 2004 6:27 PM
Subject: Re: [lpc2100] Re: LPCC footprint and assembly


> yes, strange,
> on philips's site
> http://www.semiconductors.philips.com/products/
> General Product Info/Package Info (javascript)
> search for LPCC has no results
> 
> 7X7 HVQFN48 packages are listed
> http://www.semiconductors.philips.com/package/SOT619-1.html
> http://www.semiconductors.philips.com/package/SOT619-2.html
> http://www.semiconductors.philips.com/package/SOT619-3.html
> http://www.semiconductors.philips.com/package/SOT619-4.html
> 6X6 HVQFN48 package listed
> http://www.semiconductors.philips.com/package/SOT778-1.html
> 
> which one is yours Leon?

I found the package drawing: SOT619-2.pdf

> how can it be, samples with no specs?

I've posted a msg on the Philips MCU forum, pointing out how silly it is.

Leon

--- In lpc2100@yahoogroups.com, "leon_heller" <leon_heller@h...> wrote:
> Being the proud posessor of one of the LPCC-packaged versions of the
> LPC2106 that Philips has been giving away as samples (thanks, Dave),
> I've been trying to find information on the recommended PCB land
> pattern. I eventually found it on the web site of the company who
> makes the package and have uploaded it to the group's File area:
lpcc.pdf.
> 
> It looks as though it really requires similar assembly techniques to
> those used for BGA devices, but it might be do-able using a fine tip.
> The ADI ADXL202 accelerometer uses a somewhat similar package (only
> eight pads, though) and I have successfully soldered one of those to a
> home-made PCB.
> 
> Leon

Leon,
 A method I use to solder these packages is to use your finest tip,
then take a small piece of wire, cut it at an angle so the tip is
sharp, then use that as a wedge to get the solder to bridge the pin to
 the pad.

 Also, bring the pads out from under the part a few mills further than
suggested, then move them back to go into production.

 The most succesfull, process I have used is a stencil, and solder
paste, then just heat the part from the top (hot air gun), when it
flows, let it cool, then use the afore mentioned method to remove any
bridges, or make unsuccesfull connections.

Jim