Using a vacuum for laminating pressure
2008-01-18 by javaguy11111
Just to toss an idea out. Has anyone tried to use some kind of vacuum bag setup applied to toner transfer, dry etch resist or solder mask application. For the case of toner transfer, I would put the pcb with the transfer sheet attached into a turkey baster bag. Suck out all the air with a vacuum pump of some kind and then heat the whole assembly. For heat you could use an iron, heat gun or maybe pop it into the toaster :) . From what I have read, the turkey baster bags are good up to 350F. Some pluses of this might be reduction of pin holes because the air is removed. Also flexing of the backing might help to constrain the toner and keep it from spreading. From what I have read, vacuum lamination has also been used to laminate multilayer pcb.